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British Standards for 31.180 Printed circuits and boards | Module: ICS 31.180

Standards Shop | ICS 31 |  ICS 31.180

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BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
SKU/ISBN:9780580966354

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BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
SKU/ISBN:9780580513176

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
SKU/ISBN:9780539129724

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
SKU/ISBN:9780539026757

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
SKU/ISBN:9780539059281

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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for prin..
SKU/ISBN:9780580965845

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
SKU/ISBN:9780539045888

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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
SKU/ISBN:9780539150889

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
SKU/ISBN:9780539042238

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BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
SKU/ISBN:9780539065480

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
SKU/ISBN:9780539046458

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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
SKU/ISBN:9.78054E+12

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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
SKU/ISBN:9780539126051

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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
SKU/ISBN:9780580977930

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of f..
SKU/ISBN:9780539125030

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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)
SKU/ISBN:9780539013108

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
SKU/ISBN:9780539165852

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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
SKU/ISBN:9780580995576

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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices
SKU/ISBN:9780539240221

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BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set for reinforcement materials. Specification for finished fabric woven from 'E' glass for printed boards
SKU/ISBN:9780539017502

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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
SKU/ISBN:9780539013061

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BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
SKU/ISBN:9780580569159

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BSI Price (PDF/Printed): £142.00
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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
SKU/ISBN:9780539067958

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BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices and systems: functional elements. Evaluation method of the stretchable resistive strain sensor
SKU/ISBN:9780539013085

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BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
SKU/ISBN:9780539298079

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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
SKU/ISBN:9780539251005

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BS IEC 62899-202-8:2024
Printed electronics Materials. Conductive ink. Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
SKU/ISBN:9780539171495

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BS EN IEC 63203-402-2:2024
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
SKU/ISBN:9780539066203

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Standards Shop | ICS 31 |  ICS 31.180

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