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British Standards for 31.180 Printed circuits and boards | Module: ICS 31.180

Standards Shop | ICS 31 |  ICS 31.180

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
SKU/ISBN:9780539059281

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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for prin..
SKU/ISBN:9780580965845

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
SKU/ISBN:9780539045888

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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
SKU/ISBN:9780539150889

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
SKU/ISBN:9780539042238

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BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
SKU/ISBN:9780539065480

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
SKU/ISBN:9780539046458

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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
SKU/ISBN:9780539129663

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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
SKU/ISBN:9780539126051

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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
SKU/ISBN:9780580977930

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of f..
SKU/ISBN:9780539125030

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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)
SKU/ISBN:9780539013108

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
SKU/ISBN:9780539165852

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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
SKU/ISBN:9780580995576

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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices
SKU/ISBN:9780539240221

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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
SKU/ISBN:9780539013061

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BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
SKU/ISBN:9780580569159

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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
SKU/ISBN:9780539067958

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BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices and systems: functional elements. Evaluation method of the stretchable resistive strain sensor
SKU/ISBN:9780539013085

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BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
SKU/ISBN:9780539298079

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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
SKU/ISBN:9780539251005

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BS IEC 62899-202-8:2024
Printed electronics Materials. Conductive ink. Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
SKU/ISBN:9780539171495

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BS EN IEC 63203-402-2:2024
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
SKU/ISBN:9780539066203

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BS EN IEC 63203-301-1:2024
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
SKU/ISBN:9780539059366

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BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
SKU/ISBN:9780539285710

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BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
SKU/ISBN:9780539164640

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BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method
SKU/ISBN:9780539155082

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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
SKU/ISBN:9780539052060

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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
SKU/ISBN:9780580601675

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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
SKU/ISBN:9780580599576

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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
SKU/ISBN:9780580601781

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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
SKU/ISBN:9780539293494

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BSI Price (PDF/Printed): £158.00
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
SKU/ISBN:9780539175967

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BSI Price (PDF/Printed): £158.00
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Standards Shop | ICS 31 |  ICS 31.180


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