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British Standards for 31.180 Printed circuits and boards | Module: ICS 31.180

Standards Shop | ICS 31 |  ICS 31.180

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BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
SKU/ISBN:0580125297

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BSI Price (PDF/Printed): £208.00
Our Price (Printed only): £187.20
BS CECC 23100-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
SKU/ISBN:0580254240

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BSI Price (PDF/Printed): £208.00
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BS CECC 23200-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
SKU/ISBN:0580254224

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BSI Price (PDF/Printed): £208.00
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BS CECC 23800-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
SKU/ISBN:0580298892

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BSI Price (PDF/Printed): £208.00
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BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
SKU/ISBN:0580298906

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BSI Price (PDF/Printed): £208.00
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BS CECC 23700-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
SKU/ISBN:0580298949

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BSI Price (PDF/Printed): £150.00
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BS EN 160101:1998
Harmonized system of quality assessment for electronic components. Blank detail specification: printed board assembly modular electronic units of assessed quality. Capability approval
SKU/ISBN:0580308324

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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
SKU/ISBN:058038523X

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BS 123200:2001
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
SKU/ISBN:0580385205

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BS 123100:2001
System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
SKU/ISBN:0580385183

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BSI Price (PDF/Printed): £126.00
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BS 6221-1:1990
Printed wiring boards Guide for the specification writer
SKU/ISBN:0580181545

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BSI Price (PDF/Printed): £126.00
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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
SKU/ISBN:0580181901

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BSI Price (PDF/Printed): £126.00
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BS EN 123400-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
SKU/ISBN:0580203093

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BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
SKU/ISBN:0580203050

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BSI Price (PDF/Printed): £150.00
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BS 123400:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
SKU/ISBN:0580385256

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BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
SKU/ISBN:0580385272

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PD IEC/TR 62899-250:2016
Printed electronics Material technologies required in printed electronics for wearable smart devices
SKU/ISBN:9780580938764

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BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
SKU/ISBN:0580182568

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BSI Price (PDF/Printed): £208.00
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BS EN 123200:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
SKU/ISBN:0580175049

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BSI Price (PDF/Printed): £208.00
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BS EN 123100:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
SKU/ISBN:0580174816

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BS EN 61249-8-8:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
SKU/ISBN:0580284654

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BSI Price (PDF/Printed): £126.00
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
SKU/ISBN:0580287343

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BSI Price (PDF/Printed): £126.00
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BS EN 123500:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
SKU/ISBN:0580182576

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BSI Price (PDF/Printed): £244.00
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BS EN 160100:1998
Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
SKU/ISBN:0580292142

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BSI Price (PDF/Printed): £244.00
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BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
SKU/ISBN:0580254259

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BSI Price (PDF/Printed): £244.00
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BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
SKU/ISBN:0580298914

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BSI Price (PDF/Printed): £244.00
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BS CECC 23200-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
SKU/ISBN:0580298922

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BSI Price (PDF/Printed): £208.00
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BS CECC 23100-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
SKU/ISBN:0580298930

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BSI Price (PDF/Printed): £208.00
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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
SKU/ISBN:0580301923

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BSI Price (PDF/Printed): £244.00
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BS CECC 265001:1998
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
SKU/ISBN:0580308529

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BSI Price (PDF/Printed): £244.00
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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
SKU/ISBN:0580395782

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
SKU/ISBN:0580325318

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-3-3:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyester film
SKU/ISBN:0580325334

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BS 123000:2001
System of quality assessment. Generic specification. Printed boards
SKU/ISBN:0580385175

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BSI Price (PDF/Printed): £244.00
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BS 123100-003:2001
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
SKU/ISBN:0580385191

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BSI Price (PDF/Printed): £244.00
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
SKU/ISBN:0580385213

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BSI Price (PDF/Printed): £244.00
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
SKU/ISBN:0580385221

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BSI Price (PDF/Printed): £244.00
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BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
SKU/ISBN:0580385248

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BSI Price (PDF/Printed): £232.00
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BS 123500-003:2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
SKU/ISBN:0580385264

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BSI Price (PDF/Printed): £244.00
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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
SKU/ISBN:0580385299

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BSI Price (PDF/Printed): £232.00
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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
SKU/ISBN:0580385280

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BSI Price (PDF/Printed): £198.00
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BS 123700:2001
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
SKU/ISBN:0580385302

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BSI Price (PDF/Printed): £208.00
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BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
SKU/ISBN:0580385310

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BSI Price (PDF/Printed): £208.00
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BS 123800:2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
SKU/ISBN:0580385329

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BSI Price (PDF/Printed): £232.00
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
SKU/ISBN:0580385167

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BSI Price (PDF/Printed): £208.00
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BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
SKU/ISBN:9780580533150

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BSI Price (PDF/Printed): £142.00
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BS EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
SKU/ISBN:0580459365

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580459357

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BS EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580459276

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
SKU/ISBN:0580473511

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
SKU/ISBN:0580473503

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
SKU/ISBN:0580473473

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BSI Price (PDF/Printed): £142.00
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
SKU/ISBN:9780580552489

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BSI Price (PDF/Printed): £126.00
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DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
SKU/ISBN:9780580508059

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BSI Price (PDF/Printed): £276.00
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
SKU/ISBN:9780580594724

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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
SKU/ISBN:9780580693250

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BSI Price (PDF/Printed): £290.00
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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (verti..
SKU/ISBN:9780580730757

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BS EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined fla..
SKU/ISBN:9780580730764

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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
SKU/ISBN:9780580821219

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BSI Price (PDF/Printed): £244.00
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PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
SKU/ISBN:9780580821240

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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
SKU/ISBN:9780580833397

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BSI Price (PDF/Printed): £314.00
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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
SKU/ISBN:9780580854408

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BSI Price (PDF/Printed): £208.00
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PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
SKU/ISBN:9780580854415

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BS EN 61249-7-1:1996
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
SKU/ISBN:0580260313

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BSI Price (PDF/Printed): £126.00
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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
SKU/ISBN:0580175057

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BSI Price (PDF/Printed): £244.00
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BS CECC 123500-003:1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
SKU/ISBN:0580227324

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BSI Price (PDF/Printed): £244.00
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BS CECC 123400-003:1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
SKU/ISBN:0580227316

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BSI Price (PDF/Printed): £244.00
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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
SKU/ISBN:0580273180

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BSI Price (PDF/Printed): £150.00
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
SKU/ISBN:0580273172

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BSI Price (PDF/Printed): £150.00
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
SKU/ISBN:0580274853

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BSI Price (PDF/Printed): £244.00
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BS EN 62326-4-1:1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
SKU/ISBN:0580274799

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BSI Price (PDF/Printed): £290.00
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
SKU/ISBN:0580306585

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BSI Price (PDF/Printed): £244.00
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BS EN 61249-2-18:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad
SKU/ISBN:058039607X

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BSI Price (PDF/Printed): £208.00
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BS EN 61076-4-114:2003
Connectors for electronic equipment. Printed board connectors with assessed quality Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
SKU/ISBN:0580420833

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BSI Price (PDF/Printed): £276.00
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BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flamma..
SKU/ISBN:0580423913

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BS EN 61249-2-9:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated ..
SKU/ISBN:0580423905

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BS EN 61249-2-21:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580434222

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BS EN 61249-2-4:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
SKU/ISBN:0580396061

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BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
SKU/ISBN:9780580612794

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BS EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
SKU/ISBN:9780580535222

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BS EN 62326-1:2002
Printed boards Generic specification
SKU/ISBN:0580402657

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BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-cla..
SKU/ISBN:0580459268

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BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
SKU/ISBN:058047349X

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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
SKU/ISBN:9780580601675

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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580459284

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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580434230

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BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
SKU/ISBN:9780580573835

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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580434206

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BS EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical b..
SKU/ISBN:058042393X

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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
SKU/ISBN:0580434214

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BS EN 61249-2-7:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
SKU/ISBN:0580402649

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BS EN 62496-1:2009
Optical circuit boards General
SKU/ISBN:9780580584350

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BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) ..
SKU/ISBN:9780580588105

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BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical bu..
SKU/ISBN:9780580588112

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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flam..
SKU/ISBN:9780580588129

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BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertic..
SKU/ISBN:9780580588136

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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
SKU/ISBN:9780580588181

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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-fr..
SKU/ISBN:9780580588198

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BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assemb..
SKU/ISBN:9780580588204

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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
SKU/ISBN:9780580599293

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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
SKU/ISBN:9780580599576

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BS EN 61188-5-8:2008
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
SKU/ISBN:9780580599583

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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
SKU/ISBN:9780580601781

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BS EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead..
SKU/ISBN:9780580623219

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BS EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad..
SKU/ISBN:9780580672798

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BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance
SKU/ISBN:9780580683558

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BS EN 62496-3:2011
Optical circuit boards Performance standards. General and guidance
SKU/ISBN:9780580683565

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BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
SKU/ISBN:9780580688690

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BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for..
SKU/ISBN:9780580693267

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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copp..
SKU/ISBN:9780580693274

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BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
SKU/ISBN:9780580693526

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BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead..
SKU/ISBN:9780580693533

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BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
SKU/ISBN:9780580701894

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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
SKU/ISBN:9780580821226

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BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate a..
SKU/ISBN:9780580838217

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BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
SKU/ISBN:9780580900181

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BS EN 61189-5-3:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
SKU/ISBN:9780580900198

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BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
SKU/ISBN:9780580900204

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BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)
SKU/ISBN:0580261670

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BS EN 61290-11-2:2005
Optical amplifiers. Test methods Polarization mode dispersion parameter
SKU/ISBN:0580460495

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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
SKU/ISBN:0580492125

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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
SKU/ISBN:9780580765568

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BS EN 61249-2-43:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper..
SKU/ISBN:9780580831829

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BS EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad ..
SKU/ISBN:9780580831836

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BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
SKU/ISBN:9780580873812

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BS EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
SKU/ISBN:9780580882661

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PD IEC/TS 61189-3-301:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
SKU/ISBN:9780580938030

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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
SKU/ISBN:9780580973017

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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
SKU/ISBN:9780580990984

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BS EN 61290-4-2:2011
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
SKU/ISBN:9780580681844

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BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
SKU/ISBN:9780580514838

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BS EN 60097:1993
Specification for grid systems for printed circuits
SKU/ISBN:0580221008

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BS EN 61754-20-100:2012
Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106
SKU/ISBN:9780580618482

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BS EN IEC 61189-2-630:2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
SKU/ISBN:9780580973093

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PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
SKU/ISBN:9780580911927

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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
SKU/ISBN:9.78058E+12

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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
SKU/ISBN:9780580911934

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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
SKU/ISBN:9780539033595

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BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during tempe..
SKU/ISBN:9780580851421

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BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs
SKU/ISBN:9780580767029

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BS IEC 62899-401:2017
Printed electronics Printability. Overview
SKU/ISBN:9780580916137

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BS EN 61188-7:2017
Printed boards and printed board assemblies. Design and use Electronic component zero orientation for CAD library construction
SKU/ISBN:9780580924217

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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
SKU/ISBN:9.78058E+12

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BS IEC 62899-402-1:2017
Printed electronics Printability. Measurement of qualities. Pattern width
SKU/ISBN:9780580892011

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PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for sur..
SKU/ISBN:9780539000689

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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (..
SKU/ISBN:9780580992001

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BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vert..
SKU/ISBN:9780580992018

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BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (..
SKU/ISBN:9780580991998

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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
SKU/ISBN:9780539051186

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BS EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Process ionic contamination testing (PICT)
SKU/ISBN:9780580517310

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BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
SKU/ISBN:9780580966354

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BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
SKU/ISBN:9780580513176

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
SKU/ISBN:9780539129724

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
SKU/ISBN:9780539026757

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
SKU/ISBN:9780539059281

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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for prin..
SKU/ISBN:9780580965845

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
SKU/ISBN:9780539045888

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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
SKU/ISBN:9780539150889

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
SKU/ISBN:9780539042238

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BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
SKU/ISBN:9780539065480

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
SKU/ISBN:9780539046458

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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
SKU/ISBN:9.78054E+12

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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
SKU/ISBN:9780539126051

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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
SKU/ISBN:9780580977930

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of f..
SKU/ISBN:9780539125030

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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)
SKU/ISBN:9780539013108

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
SKU/ISBN:9780539165852

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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
SKU/ISBN:9780580995576

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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices
SKU/ISBN:9780539240221

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BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set for reinforcement materials. Specification for finished fabric woven from 'E' glass for printed boards
SKU/ISBN:9780539017502

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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
SKU/ISBN:9780539013061

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BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
SKU/ISBN:9780580569159

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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test
SKU/ISBN:9780539067958

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BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices and systems: functional elements. Evaluation method of the stretchable resistive strain sensor
SKU/ISBN:9780539013085

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BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
SKU/ISBN:9780539298079

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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
SKU/ISBN:9780539251005

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BS IEC 62899-202-8:2024
Printed electronics Materials. Conductive ink. Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
SKU/ISBN:9780539171495

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BS EN IEC 63203-402-2:2024
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
SKU/ISBN:9780539066203

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