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BS EN IEC 61189-2-801:2023 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials


Buy a printed copy from us with a 10% discount, or follow the link to purchase a PDF on the BSI website.

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ISBN: 9780539285710

Keywords:
Performance, Thermal conductivity, Structures, Printing board, Test methods, PDF
Publication Date25 Dec 2023
Product SKU30479715
ISBN9780539285710
BSI CodeBS EN IEC 61189-2-801:2023
No. of pages16
CorrectsBS IEC 61189-2-801:2023
PublisherBritish Standards Institution
Identical National Standard to:
  • EN IEC 61189-2-801:2023
  • IEC 61189-2-801:2023




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