Buy British Standards OnlineBuy Standards Online Worldwide Delivery AvailableBuy Downloads of British StandardsSecure Online Ordering
Start of Content

BS EN IEC 61189-2-807:2021 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA


Buy a printed copy from us with a 10% discount, or follow the link to purchase a PDF on the BSI website.

BSI Price (PDF/Printed): £126.00
Our Price (Printed only): £113.40



ISBN: 9780539126051

Keywords:
Structures, Open systems interconnection, Printing board, Testing methods, PDF
Publication Date05 Nov 2021
Product SKU30409141
ISBN9780539126051
BSI CodeBS EN IEC 61189-2-807:2021
No. of pages14
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 61189-2-807 Ed.1.0
  • IEC 61189-2-807 Ed.1.0




spacer
End of Content
Standards A-Z Subject Index
© 2016 - 2024 BuyStandardsOnline.co.uk | Sitemap | Ways To Order | Delivery Charges | Contact Us | Terms and Conditions | Official BSI Distributor | Worldwide Delivery