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BS EN IEC 61189-2-807:2021 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA


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ISBN: 9780539126051

Keywords:
Structures, Open systems interconnection, Printing board, Testing methods, PDF
Publication Date05 Nov 2021
Product SKU30409141
ISBN9780539126051
BSI CodeBS EN IEC 61189-2-807:2021
No. of pages14
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 61189-2-807 Ed.1.0
  • IEC 61189-2-807 Ed.1.0




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