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BS EN IEC 61189-2-808:2024 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method

Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method

BS EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method


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ISBN: 9780539155082

Keywords:
Testing methods, Electrical connections, Electrical conductivity, Electrically-conducting materials, Printing board, Thermal resistance, Thermal behaviour of structures, PDF
Publication Date04 Jun 2024
Product SKU30427158
ISBN9780539155082
BSI CodeBS EN IEC 61189-2-808:2024
No. of pages26
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 61189-2-808 Ed.1.0
  • IEC 61189-2-808 Ed.1.0




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