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BS EN IEC 61189-3-302:2025 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)


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ISBN: 9780539310191

Keywords:
Testing methods, Electrical equipment, Printed-circuit boards, Printing board, Tomography, Computed tomography, PDF
Publication Date02 Dec 2025
Product SKU30488911
ISBN9780539310191
BSI CodeBS EN IEC 61189-3-302:2025
No. of pages24
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 61189-3-302:2025
  • EN IEC 61189-3-302:2025




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