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BS EN IEC 63251:2023 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

BS EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress


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ISBN: 9780539052060

Keywords:
Test methods, Printed-circuit boards, Stress, Thermal stress, Reliability, Assessed reliability, PDF
Publication Date19 Dec 2023
Product SKU30396946
ISBN9780539052060
BSI CodeBS EN IEC 63251:2023
No. of pages26
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 63251 Ed.1.0
  • IEC 63251 Ed.1.0




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