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BS EN IEC 62878-2-603:2025 | British Standards

Standards Shop | ICS 31 |  ICS 31.180

31.180 Printed circuits and boards

Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity

BS EN IEC 62878-2-603:2025

Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity


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ISBN: 9780539175967

Keywords:
Assembly, Testing methods, Electrical testing, Electrical connections, Stacks, Bus networks, PDF
Publication Date16 Apr 2025
Product SKU30436875
ISBN9780539175967
BSI CodeBS EN IEC 62878-2-603:2025
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 62878-2-603 Ed.1.0
  • IEC 62878-2-603 Ed.1.0




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