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British Standards for 31.190 Electronic component assemblies | Module: ICS 31.190

Standards Shop | ICS 31 |  ICS 31.190

BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality Index of test methods
SKU/ISBN:0580284530

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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
SKU/ISBN:0580402614

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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
SKU/ISBN:0580427609

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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
SKU/ISBN:0580278514

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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
SKU/ISBN:0580394433

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BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
SKU/ISBN:0580421104

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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
SKU/ISBN:9780580553332

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BS EN 62421:2007
Electronics assembly technology. Electronic modules
SKU/ISBN:9780580557620

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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
SKU/ISBN:9780580621048

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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
SKU/ISBN:9780580645716

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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
SKU/ISBN:9780580685910

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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
SKU/ISBN:9780580761591

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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
SKU/ISBN:9780580778407

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
SKU/ISBN:9780580821202

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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
SKU/ISBN:9780580889967

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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
SKU/ISBN:9780539066241

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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
SKU/ISBN:9780580955785

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BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
SKU/ISBN:9780539051469

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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
SKU/ISBN:9780580898426

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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
SKU/ISBN:9780580966422

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BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
SKU/ISBN:9780580892387

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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
SKU/ISBN:9780580973048

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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
SKU/ISBN:9780580965838

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BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
SKU/ISBN:9780539021820

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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
SKU/ISBN:9780539045857

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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
SKU/ISBN:9780580997181

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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
SKU/ISBN:9780539136586

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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
SKU/ISBN:9780539233780

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PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
SKU/ISBN:9780539179361

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BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
SKU/ISBN:9780539024449

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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
SKU/ISBN:9780580553578

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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
SKU/ISBN:9780539250992

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Standards Shop | ICS 31 |  ICS 31.190

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