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BS EN IEC 61760-3:2021 | British Standards

Standards Shop | ICS 31 |  ICS 31.190

31.190 Electronic component assemblies

Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering

Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering

BS EN IEC 61760-3:2021

Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering


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ISBN: 9780539045857

Keywords:
Marking, Packaging, Surface mounting devices, Soldering, Electronic equipment and components, Cleaning, Integrated circuit technology, Solderability testing, Microassembling, Electrical components, Holes, Integrated circuits, PDF
Publication Date18 Mar 2021
Product SKU30394490
ISBN9780539045857
BSI CodeBS EN IEC 61760-3:2021
No. of pages34
ReplacesBS EN 61760-3:2010
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 61760-3 Ed.2.0
  • IEC 61760-3 Ed.2.0




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