BS EN IEC 61190-1-3:2018 | British Standards

Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

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ISBN: 9780580892387

Keywords:
Electrical connections, Solders, Pastes, Test methods, Quality assurance, Bonding, Particulate materials, Fluxes (materials), Soldering, Classification systems, Bars (materials), Quality control, Electronic engineering, Electronic equipment and components, PDF

Publication Date	28 Mar 2018
Product SKU	30318682
ISBN	9780580892387
BSI Code	BS EN IEC 61190-1-3:2018
No. of pages	50
Replaces	BS EN 61190-1-3:2007+A1:2010
Publisher	British Standards Institution

Identical National Standard to:

EN 60076-1:2011
IEC 61190-1-3:2017
EN IEC 61190-1-3:2018

BS EN IEC 61190-1-3:2018 | British Standards

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