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BS EN IEC 62878-2-5:2019 | British Standards

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31.190 Electronic component assemblies

Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

BS EN IEC 62878-2-5:2019

Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate


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ISBN: 9780580965838

Keywords:
Substrates (insulating), Structures, Electric connectors, Components, Electronic equipment and components, PDF
Publication Date18 Nov 2019
Product SKU30352486
ISBN9780580965838
BSI CodeBS EN IEC 62878-2-5:2019
No. of pages58
ReplacesPD IEC/PAS 62878-2-5:2015
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 62878-2-5 Ed1.0
  • EN 62878-2-5 Ed.1.0




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