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PD IEC TR 61760-3-1:2022 | British Standards

Standards Shop | ICS 31 |  ICS 31.190

31.190 Electronic component assemblies

Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

PD IEC TR 61760-3-1:2022

Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method


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ISBN: 9780539179361

Keywords:
Components, Electrical components, Circuits, Integrated circuits, Surface mounting devices, Solders, PDF
Publication Date31 Oct 2022
Product SKU30438361
ISBN9780539179361
BSI CodePD IEC TR 61760-3-1:2022
No. of pages30
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC/TR 61760-3-1 Ed.1.0




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