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BS IEC 63378-2-1:2024 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

BS IEC 63378-2-1:2024

Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages


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ISBN: 9780539258998

Keywords:
Standardization, Semiconductors, Packages, Thermal resistance, Accuracy, Mathematical models, Models (testing), PDF
Publication Date29 Oct 2024
Product SKU30469487
ISBN9780539258998
BSI CodeBS IEC 63378-2-1:2024
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 63378-2-1:2024




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