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BS IEC 63011-2:2018 | British Standards

Standards Shop | ICS 31 |  ICS 31.200

31.200 Integrated circuits. Microelectronics

Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect


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ISBN: 9780580973758

Keywords:
Test equipment, Impulse-voltage tests, Electrical measurement, Impulse voltages, Electronic equipment and components, Semiconductors, Integrated circuits, Electromagnetic compatibility, Transient voltages, PDF
Publication Date24 Jan 2019
Product SKU30355727
ISBN9780580973758
BSI CodeBS IEC 63011-2:2018
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 63011-2:2018




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