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BS IEC 62047-38:2021 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.99

31.080.99 Other semiconductor devices

Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection

Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection

BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection


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ISBN: 9780539067514

Keywords:
Vocabulary, Electromechanical devices, Integrated circuits, Terminology, Electronic equipment and components, Semiconductor technology, Semiconductor devices, PDF
Publication Date07 Jul 2021
Product SKU30404084
ISBN9780539067514
BSI CodeBS IEC 62047-38:2021
No. of pages16
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 62047-38 Ed.1.0




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