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BS IEC 62047-31:2019 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.99

31.080.99 Other semiconductor devices

Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials

Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials

BS IEC 62047-31:2019

Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials


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ISBN: 9780580966606

Keywords:
CD-ROM, Data layout, Data transfer, Digital signals, Recording characteristics, Optical properties of materials, Coding (data conversion), Information exchange, Recording tracks, Data transmission, Error correction, Data processing, Environment (working), Read-only storage, Dimensions, Data media, Computer storage devices, Data recording, Optical disks, Storage, Testing conditions, Optical recordi, PDF
Publication Date17 Apr 2019
Product SKU30352563
ISBN9780580966606
BSI CodeBS IEC 62047-31:2019
No. of pages16
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 62047-31 Ed.1.0
  • ERROR




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