BS IEC 62047-27:2017 | British Standards

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Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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ISBN: 9780580899096

Keywords:
Resonance, Vibration, Semiconductor devices, Thin-film devices, Semiconductor technology, Fatigue testing, Electromechanical devices, Integrated circuits, Test specimens, Electronic equipment and components, Test equipment, Bend testing, PDF

Publication Date	22 Jul 2020
Product SKU	30321849
ISBN	9780580899096
BSI Code	BS IEC 62047-27:2017
No. of pages	20
Publisher	British Standards Institution

Identical National Standard to:

IEC 62047-27:2017

BS IEC 62047-27:2017 | British Standards

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