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BS EN IEC 60749-22-2:2026 | British Standards

Standards Shop | ICS 29 | ICS 29.100 |  ICS 29.100.10

29.100.10 Magnetic components

Semiconductor devices — Mechanical and climatic test methods Bond strength — Wire bond shear test methods

Semiconductor devices — Mechanical and climatic test methods Bond strength — Wire bond shear test methods

BS EN IEC 60749-22-2:2026

Semiconductor devices — Mechanical and climatic test methods Bond strength — Wire bond shear test methods


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ISBN: 9780539340679

Keywords:
Climate, Bonding, Electronic equipment and components, Environmental testing, Mechanical testing, Integrated circuits, Strength of materials, Semiconductor devices, PDF
Publication Date21 Jan 2026
Product SKU30502908
ISBN9780539340679
BSI CodeBS EN IEC 60749-22-2:2026
No. of pages40
PublisherBritish Standards Institution
Identical National Standard to:
  • EN IEC 60749-22-2 ED1
  • IEC 60749-22-2:2025




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