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BS EN IEC 60749-22-1:2026 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Semiconductor devices — Mechanical and climatic test methods Bond strength — wire bond pull test methods

Semiconductor devices — Mechanical and climatic test methods Bond strength — wire bond pull test methods

BS EN IEC 60749-22-1:2026

Semiconductor devices — Mechanical and climatic test methods Bond strength — wire bond pull test methods


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ISBN: 9780539340389

Keywords:
Semiconductor devices, Strength of materials, Mechanical tests, Integrated circuits, Environmental testing, Electronic equipment and components, Climate, PDF
Publication Date21 Jan 2026
Product SKU30502825
ISBN9780539340389
BSI CodeBS EN IEC 60749-22-1:2026
No. of pages68
PublisherBritish Standards Institution
Identical National Standard to:
  • EN IEC 60749-22-1 ED1
  • IEC 60749-22-1:2025




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