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BS EN IEC 60749-20-1:2026 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Semiconductor devices – Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Semiconductor devices – Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

BS EN IEC 60749-20-1:2026

Semiconductor devices – Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat


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ISBN: 9780539413885

Keywords:
Mechanical testing, Transportation, Semiconductor devices, Electronic equipment and components, Damp-heat tests, Integrated circuits, Climate, Environmental testing, Labelling (process), Soldering, Environment (working), Thermal testing, Surface mounting devices, Materials handling, Packaging, PDF
Publication Date09 Mar 2026
Product SKU30556702
ISBN9780539413885
BSI CodeBS EN IEC 60749-20-1:2026
No. of pages44
ReplacesBS EN 60749-20-1:2009
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 60749-20-1
  • IEC 60749-20-1:2019




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