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BS EN 60749-20-1:2009 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat


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ISBN: 9780580546013

Keywords:
Mechanical testing, Transportation, Semiconductor devices, Electronic equipment and components, Damp-heat tests, Integrated circuits, Climate, Environmental testing, Labelling (process), Soldering, Environment (working), Thermal testing, Surface mounting devices, Materials handling, Packaging, PDF
Publication Date31 Jul 2009
Product SKU30119209
ISBN9780580546013
BSI CodeBS EN 60749-20-1:2009
No. of pages38
PublisherBritish Standards Institution
Identical National Standard to:
  • EN 60749-20-1:2009
  • IEC 60749-20-1:2009




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