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BS EN 60191-6-4:2003 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)


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ISBN: 0580423565

Keywords:
Surface mounting devices, Standardization, Integrated circuits, Electronic equipment and components, Semiconductor technology, Semiconductor devices, Dimensions, Drawings, Engineering drawings, PDF
Publication Date04 Aug 2003
Product SKU30061212
ISBN0580423565
BSI CodeBS EN 60191-6-4:2003
No. of pages20
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 60191-6-4:2003
  • EN 60191-6-4 (IEC 60191-6-4:2003) AS




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