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BS EN 60191-6-3:2001 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

BS EN 60191-6-3:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)


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ISBN: 058037243X

Keywords:
Integrated circuits, Engineering drawings, Standardization, Semiconductor devices, Electronic equipment and components, Packages, Dimensions, Flat (shape), Drawings, Surface mounting devices, PDF
Publication Date15 May 2001
Product SKU30039593
ISBN058037243X
BSI CodeBS EN 60191-6-3:2001
No. of pages20
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 60191-6-3:2000
  • EN 60191-6-3:2000




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