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BS EN 60191-6-21:2010 | British Standards

Standards Shop | ICS 35 | ICS 35.100 |  ICS 35.100.05

35.100.05 Multilayer applications

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BS EN 60191-6-21:2010

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)


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ISBN: 9780580645679

Keywords:
Printed-circuit boards, Dimensions, Semiconductor devices, Drawings, Electric connectors, Electronic equipment and components, Surface mounting devices, Integrated circuits, Engineering drawings, Standardization, PDF
Publication Date31 Dec 2010
Product SKU30190031
ISBN9780580645679
BSI CodeBS EN 60191-6-21:2010
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 60191-6-21:2010
  • IEC TR 62453-62:2017
  • EN 61557-5:2007
  • EN 60191-6-21:2010




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