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BS EN 62047-9:2011 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.99

31.080.99 Other semiconductor devices

Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS

Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS

BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS


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ISBN: 9780580787935

Keywords:
Semiconductor devices, Bonding, Tensile testing, Substrates (insulating), Electrostatics, Electronic equipment and components, Electromechanical devices, Bend testing, Shear testing, Visual inspection (testing), Adhesive strength, Integrated circuits, Semiconductor technology, Adhesion tests, PDF
Publication Date31 Jan 2013
Product SKU30262153
ISBN9780580787935
BSI CodeBS EN 62047-9:2011
No. of pages30
CorrectsBS EN 62047-9:2011
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 62047-9:2011/COR1:2012




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