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BS EN 62047-13:2012 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.99

31.080.99 Other semiconductor devices

Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

BS EN 62047-13:2012

Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures


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ISBN: 9780580694509

Keywords:
Semiconductor devices, Semiconductor technology, Electromechanical devices, Test equipment, Resonance, Integrated circuits, Bend testing, Test specimens, Fatigue testing, Electronic equipment and components, Thin-film devices, Vibration, PDF
Publication Date31 May 2012
Product SKU30211455
ISBN9780580694509
BSI CodeBS EN 62047-13:2012
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 61097-4:2012/AMD1:2016
  • EN 62047-13:2012
  • IEC 62047-13:2012




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