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BS EN 60191-6-19:2010 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage




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ISBN: 9780580607585

Keywords:
Standardization, Electronic equipment and components, Thermal testing, Concave, Heating tests, Surface mounting devices, Semiconductor devices, Convex, Curved, Integrated circuits, Dimensional measurement, Dimensions, Technical data sheets, PDF
Publication Date30 Jun 2010
Product SKU30172910
ISBN9780580607585
BSI CodeBS EN 60191-6-19:2010
No. of pages18
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 60191-6-19:2010
  • IEC PAS 60191-6-19:2008
  • EN 60191-6-19:2010




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