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BS 3934-5:1997 | British Standards

Standards Shop | ICS 31 | ICS 31.080 |  ICS 31.080.01

31.080.01 Semiconductor devices in general

Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

BS 3934-5:1997

Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits


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ISBN: 0580278123

Keywords:
Dimensional tolerances, Tape, Films (states of matter), Perforations, Mechanical behaviour of materials, Datum, Mechanical properties of materials, Dimensions, Standardization, Codes, Bonding, Electronic equipment and components, Holes, Electrical connections, Flexible materials, Integrated circuits, Semiconductor devices, PDF
Publication Date15 Sep 1997
Product SKU1094344
ISBN0580278123
BSI CodeBS 3934-5:1997
No. of pages38
ReplacesBS 3934-5:1992
PublisherBritish Standards Institution
Identical National Standard to:
  • IEC 60191-5:1997




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